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Intel Xeon E5 2690 V3 E5-2690V3 2.6 GHz Used Twelve-Core Twenty-four-Thread 30MB 135W CPU LGA 2011

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Beschreibung
SPECIFICATIONS

Application: Server

Brand Name: Intel

Chip Process: 22 Nanometers

Choice: yes

Cooling system: No

Default TDP / TDP: 135

GPU-built: No

High-concerned chemical: None

Intel Model: Intel Xeon E5-2690V3

L2 Cache Capacity: 3MB

L3 Cache Capacity: 30MB

Number OF Therads: 24

Number of Cores: Twelve Cores

Origin: MY(Origin)

PCIe VERSION: PCIe 2.0

Package: No

Processor Type: Intel Xeon

Socket Type: LGA 2011-V3

Support Chipset Models: Intel Others

Support Memory Channels: 2

Support Memory Type: DDR4

Type: Twelve-Core

Unlocked: Yes

Usage Scenario: others

Intel Xeon E5-2690 v3 is a server processor in the Intel Xeon E5 v3 series, manufactured using 22nm technology. Its detailed parameters are as follows:

Core parameters: It has 12 cores and 24 threads, with a basic processor frequency of 2.60GHz and a maximum turbo frequency of 3.50GHz. It is equipped with 30MB Intel Smart Cache, a bus speed of 9.6GT/s, and 2 QPI links.

Power consumption: The thermal design power consumption (TDP) is 135W.

Memory specifications: The maximum supported memory size is 768GB, the memory type is DDR4 1600/1866/2133, the maximum number of memory channels is 4, the maximum memory bandwidth is 68GB/s, and ECC memory is supported.

Expansion options: Scalability is 2S, PCI Express revision 3.0, PCI Express configuration is x4, x8, x16, and the maximum number of PCI Express channels is 40.

Advanced Technology: Supports Intel Turbo Boost 2.0, Hyper Threading Technology, Intel AES New Instructions, Temperature Monitoring Technology, Virtualization Technology (VT-x, VT-d), etc.

Intel Xeon E5-2690 v3 specifications

General information

Type

CPU / Microprocessor

Market segment

Server

Family

 Intel Xeon E5-2600 v3


Model number  ? 

 E5-2690 v3

CPU part numbers

  • CM8064401439416 is an OEM/tray microprocessor

  • BX80644E52690V3 is a boxed microprocessor

Frequency ? 

2600 MHz

Maximum turbo frequency

3500 MHz

Bus speed ? 

9.6 GT/s QPI (4800 MHz)
5 GT/s DMI

Clock multiplier ? 

26

Package

2011-land Flip-Chip Land Grid Array

Socket

Socket 2011-3 / R3 / LGA2011-3

Size

2.07" x 1.77" / 5.25cm x 4.5cm

Introduction date

September 8, 2014

Price at introduction


S-spec numbers

Part number

ES/QS processors

Production processors


QFRX

QGNY

SR1XN

BX80644E52690V3



+

CM8064401439416



+

Unknown

+

+


Architecture / Microarchitecture

Microarchitecture

Haswell

Platform

Grantley-EP


Processor core  ? 

Haswell-EP


Core steppings  ? 

M0 (QFRX)
M1 (QGNY, SR1XN)

CPUID

306F2 (SR1XN)

Manufacturing process

0.022 micron

Data width

64 bit

The number of CPU cores

12

The number of threads

24

Floating Point Unit

Integrated


Level 1 cache size  ? 

12 x 32 KB 8-way set associative instruction caches
12 x 32 KB 8-way set associative data caches

Level 2 cache size ? 

12 x 256 KB 8-way set associative caches

Level 3 cache size

30 MB 20-way set associative shared cache

Physical memory

768 GB

Multiprocessing

Up to 2 processors

Extensions and Technologies

  • MMX instructions

  • SSE / Streaming SIMD Extensions

  • SSE2 / Streaming SIMD Extensions 2

  • SSE3 / Streaming SIMD Extensions 3

  • SSSE3 / Supplemental Streaming SIMD Extensions 3


  • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4  ? 

  • AES / Advanced Encryption Standard instructions

  • AVX / Advanced Vector Extensions

  • AVX2 / Advanced Vector Extensions 2.0

  • BMI / BMI1 + BMI2 / Bit Manipulation instructions

  • F16C / 16-bit Floating-Point conversion instructions

  • FMA3 / 3-operand Fused Multiply-Add instructions


  • EM64T / Extended Memory 64 technology / Intel 64  ? 


  • NX / XD / Execute disable bit  ? 


  • HT / Hyper-Threading technology  ? 


  • VT-x / Virtualization technology  ? 

  • VT-d / Virtualization for directed I/O


  • TBT 2.0 / Turbo Boost technology 2.0  ? 

  • TXT / Trusted Execution technology

  • TSX / Transactional Synchronization Extensions

Low power features


Enhanced SpeedStep technology  ? 

Integrated peripherals / components

Integrated graphics

None

Memory controller

The number of controllers: 2
Memory channels per controller: 2
Supported memory: DDR4-1600, DDR4-1866, DDR4-2133
DIMMs per channel: 3
Maximum memory bandwidth (GB/s): 68.3
ECC supported: Yes

Other peripherals

  • Direct Media Interface 2.0

  • Quick Path Interconnect v1.1 (2 links)

  • PCI Express 3.0 interface (40 lanes)

Electrical / Thermal parameters


V core  ? 

0.65V - 1.3V


Maximum operating temperature  ? 

89.9°C

Minimum power dissipation

38 Watt (C1E state)
13 Watt (C6 state)

Thermal Design Power ? 

135 Watt
 

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