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Intel Xeon E3 1230 V2 E3 1230V2 Used 3.3 GHz 8M 69W CPU Processor LGA 1155

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Beschreibung
SPECIFICATIONS

Application: Desktop

Brand Name: Intel

Chip Process: 22 Nanometers

Choice: yes

Cooling system: No

Default TDP / TDP: 69

GPU-built: No

High-concerned chemical: None

Intel Model: 1230V2

L2 Cache Capacity: 1 MB

L3 Cache Capacity: 8 MB

Launch Date: 2004

Number OF Therads: 8

Number of Cores: Quad-Core

Origin: MY(Origin)

PCIe VERSION: PCIe 2.0

Package: No

Processor Type: Intel Xeon

Socket Type: LGA 1155

Support Chipset Models: Intel B75

Support Memory Channels: 2

Support Memory Type: DDR3

Type: Quad-Core

Unlocked: Yes

Usage Scenario: others

Intel Xeon E3-1230 V2 is a server level processor belonging to the Xeon E3 v2 series. Here are its detailed parameters: Parameter details Processor number E3-1230 V2 Photolithography at 22nm Number of kernels 4 Bus number 8 Processor basic frequency 3.30GHz Maximum turbo frequency 3.70GHz Cache 8MB Intel Smart Cache Bus speed 5GT/s TDP 69W Memory type DDR3 1333/1600 Maximum number of memory channels 2 Maximum memory bandwidth 25.6GB/s What is the supported ECC memory PCI Express Revision 3.0 Supported slots FCLGA1155 Maximum CPU configuration 1 Intel Turbo Boost Technology 2.0 Intel Hyper Threading Technology is Intel ® Transactional Synchronization Extensions - New Instructions (Intel) ® TSX-NI) No Intel ® 64 is Instruction set 64 bit Instruction Set Extension Intel ® SSE4.1，Intel ® SSE4.2，Intel ® AVX Intel ® Virtualization technology (VT-x) is Intel ® Virtualization Technology for Directed I/O (VT-d) is Intel ® VT-x with Extended Page Tables (EPT) is

Intel Xeon E3-1230 v2 specifications



General information

Type

CPU / Micro

Market segment

Server

Family

Intel Xeon E3-1200 v2

Model number?

E3-1230 v2

CPU part numbers

  • CM8063701098101is an OEM/tray micro

  • BX80637E31230V2is a boxed micro

Frequency?

3300 MHz

Maximum turbo frequency

3700 MHz (1 or 2 cores)
3600 MHz (3 cores)
3500 MHz (4 cores)

Bus speed?

5 GT/s DMI

Clock multiplier?

33

Package

1155-land Flip-Chip Land Grid Array (FCLGA 1155)

Socket

Socket 1155 / H2 / LGA1155

Size

1.48" x 1.48" / 3.75cm x 3.75cm

Introduction date

May 14, 2012

End-of-Life date

Last order date is January 23, 2015
Last shipment date for tray is January 8, 2016
Last shipment date for boxed is July 10, 2015



S-spec numbers

Part number

ES/QS s

Production rs


QBZD

SR0P4

BX80637E31230V2


+

CM8063701098101

+

+

Architecture / Microarchitecture

Microarchitecture

Ivy Bridge

Platform

Carlow

core?

Ivy Bridge-H2

Core stepping?

E1 (QBZD, SR0P4)

CPUID

306A9 (SR0P4)

Manufacturing process

0.022 micron High-K metal gate process

Data width

64 bit

The number of CPU cores

4

The number of threads

8

Floating Point Unit

Integrated

Level 1 cache size?

4 x 32 KB 8-way set associative instruction caches
4 x 32 KB 8-way set associative data caches

Level 2 cache size?

4 x 256 KB 8-way set associative caches

Level 3 cache size

8 MB 16-way set associative shared cache

Physical memory

32 GB

Multiprocessing

Uni

Features

  • MMX instructions

  • SSE / Streaming SIMD Extensions

  • SSE2 / Streaming SIMD Extensions 2

  • SSE3 / Streaming SIMD Extensions 3

  • SSSE3 / Supplemental Streaming SIMD Extensions 3

  • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4?

  • AES / Advanced Encryption Standard instructions

  • AVX / Advanced Vector Extensions

  • F16C / 16-bit Floating-Point conversion instructions

  • EM64T / Extended Memory 64 technology / Intel 64?

  • NX / XD / Execute disable bit?

  • VT-x / Virtualization technology?

  • VT-d / Virtualization for directed I/O

  • TBT 2.0 / Turbo Boost technology 2.0?

  • TXT / Trusted Execution technology

  • HT / Hyper-Threading technology?

Low power features

Enhanced SpeedStep technology?

Integrated peripherals / components

Integrated graphics

None

Memory controller

The number of controllers: 1
Memory channels: 2
Supported memory: DDR3-1333, DDR3-1600
Maximum memory bandwidth (GB/s): 25.6
ECC supported: Yes

Other peripherals

  • Direct Media Interface 2.0

  • PCI Express 3.0 interface

Electrical / Thermal parameters

Maximum operating temperature?

65.8°C

Thermal Design Power?

69 Watt

 

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